Electronic device

ABSTRACT

An electronic device that includes a display module having an active area that includes at least one pixel and a module hole and a non-active area adjacent to the active area that does not include a pixel. A window is disposed on the display module. A functional layer is disposed between the display module and the window. The functional layer includes a first opening defined therethrough that overlaps with the module hole. A light blocking layer is disposed on at least one of upper and lower surfaces of the functional layer and is positioned adjacent to the first opening. An electronic module is disposed in an opening formed by at least one of the module hole and the first opening.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2019-0022605, filed on Feb. 26, 2019, in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference in its entirety herein.

1. TECHNICAL FIELD

The present disclosure relates to an electronic device. Moreparticularly, the present disclosure relates to an electronic devicethat prevents light leakage from occurring.

2. DISCUSSION OF RELATED ART

Portable electronic devices have become very popular in recent years andprovide an increasingly diverse array of functions. Many users preferelectronic devices that have a relatively wider display area and arelatively narrower bezel area.

Various types of electronic devices have been developed to reduce thebezel areas. For example, some electronic devices omit the bezel area.These devices may include a camera and a sensor which both overlap withthe display area. The camera and sensor which overlap with the displayarea may be disposed in a hole provided in the device. However, theseelectronic devices frequently experience light leakage from regionsaround the hole which results in a decrease in the display quality.

SUMMARY

The present disclosure provides an electronic device capable ofpreventing a light leakage from occurring around a hole defined in adisplay area.

Exemplary embodiments of the present inventive concepts provide anelectronic device that includes a display module having an active areaand a non-active area adjacent to the active area. Pixels are disposedin the active area and are not disposed in the non-active area. Theactive area includes a module hole. A window is disposed on the displaymodule. A functional layer is disposed between the display module andthe window. The functional layer includes a first opening definedtherethrough that overlaps with the module hole. A light blocking layeris disposed on at least one of upper and lower surfaces of thefunctional layer and is positioned adjacent to the first opening. Anelectronic module is disposed in an opening formed by at least one ofthe module hole and the first opening.

Exemplary embodiments of the present inventive concepts further providean electronic device that includes a display module having an activearea and a non-active area adjacent to the active area. Pixels aredisposed in the active area and are not disposed in the non-active area.The active area includes a module hole. A window is disposed on thedisplay module. A window black matrix is disposed on an upper surface ora lower surface of a peripheral area of the window. The peripheral areaoverlaps a region of the display module adjacent to the module hole. Alight blocking layer is disposed between the display module and thewindow black matrix. An electronic module is disposed in an openingformed by the module hole.

Exemplary embodiments of the present inventive concepts also provide anelectronic device that includes a display module having an active areaand a non-active area adjacent to the active area Pixels are disposed inthe active area and are not disposed in the non-active area. The activearea includes a module hole. An electronic module is disposed in anopening formed by the module hole. A window is disposed on the displaymodule. The active area comprises a first area defined adjacent to themodule hole and a second area surrounding the first area. The at leastone pixel is not disposed in the first area, and the at last one pixelis disposed in the second area. The display module includes a lowerdisplay substrate comprising a base layer, a circuit device layer, and adisplay device layer. An encapsulation substrate faces the lower displaysubstrate. A light blocking sealing member is configured to couple thelower display substrate and the encapsulation substrate in the firstarea and comprises a light blocking material.

According to the exemplary embodiments, since the light blocking layeris formed in the functional layer interposed between the window and thedisplay module to overlap the peripheral area of the module hole, alight leakage phenomenon in which the light leaked from the peripheralarea of the module hole is viewed from the outside by the user may beprevented.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1A is a perspective view showing an electronic device according toan exemplary embodiment of the present disclosure;

FIG. 1B is an exploded perspective view showing an electronic deviceaccording to an exemplary embodiment of the present disclosure;

FIG. 2 is a block diagram showing an electronic device according to anexemplary embodiment of the present disclosure;

FIG. 3 is a plan view showing a display panel according to an exemplaryembodiment of the present disclosure;

FIG. 4 is an enlarged plan view showing area XX′ of FIG. 3;

FIG. 5 is a plan view showing an input sensing layer according to anexemplary embodiment of the present disclosure;

FIG. 6 is an exploded perspective view showing a module area and amodule hole of an electronic device according to an exemplary embodimentof the present disclosure;

FIG. 7 is a cross-sectional view taken along a line I-I′ of FIG. 6;

FIG. 8 is a cross-sectional view showing a module area and a module holeof an electronic device according to another exemplary embodiment of thepresent disclosure;

FIG. 9 is an exploded enlarged perspective view showing a module areaand a module hole of an electronic device according to another exemplaryembodiment of the present disclosure;

FIG. 10 is a cross-sectional view taken along a line II-II′ of FIG. 9;

FIG. 11 is an exploded enlarged perspective view showing a module areaof an electronic device according to another exemplary embodiment of thepresent disclosure;

FIG. 12 is a cross-sectional view taken along line Ill-III′ of FIG. 11;

FIG. 13 is a cross-sectional view showing an active area of a displaypanel according to an exemplary embodiment of the present disclosure;

FIG. 14 is a cross-sectional view showing a module area of an electronicdevice according to an exemplary embodiment of the present disclosure;and

FIG. 15 is a cross-sectional view showing a module area of an electronicdevice according to another exemplary embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

In the present disclosure, it will be understood that when an element orlayer is referred to as being “on”, “connected to” or “coupled to”another element or layer, it can be directly on, connected or coupled tothe other element or layer or intervening elements or layers may bepresent.

Like numerals refer to like elements throughout. In the drawings, thethickness, ratio, and dimension of components may be exaggerated foreffective description of the technical content.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Therefore, a first element, component,region, layer or section discussed below could be described as a secondelement, component, region, layer or section without departing from theteachings of the present disclosure. As used herein, the singular forms,“a”, “an” and “the” are intended to include the plural forms as well,unless the context clearly indicates otherwise.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe the relationship of one element or feature to anotherelement(s) or feature(s) as illustrated in the figures.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

It will be further understood that the terms “includes” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

Hereinafter, the present disclosure will be explained in detail withreference to the accompanying drawings.

FIG. 1A is a perspective view showing an electronic device EA accordingto an exemplary embodiment of the present disclosure. FIG. 1B is anexploded perspective view showing the electronic device EA according toan exemplary embodiment of the present disclosure. FIG. 2 is a blockdiagram showing the electronic device EA according to an exemplaryembodiment of the present disclosure.

Referring to FIGS. 1A, 1B, and 2, the electronic device EA may beactivated in response to electrical signals to display an image. Inexemplary embodiments, the electronic device EA may be a smart phone, atablet computer, a notebook computer, a television set, etc. In thepresent exemplary embodiment, a smart phone will be described as arepresentative example of the electronic device EA.

The electronic device EA may display an image IM in a third directionDR3 toward the user through a display surface FS that is defined in thefirst direction DR1 and a second direction DR2. The display surface FSthrough which the image IM is displayed may correspond to a frontsurface of the electronic device EA (e.g., a top surface of theelectronic device in the third direction DR3) and a front surface of awindow WM (e.g., a top surface of the window in the third directionDR3). Hereinafter, the display surface and the front surface of theelectronic device EA and the front surface of the window WM are assignedwith the same reference numeral. The image IM may include one or morestill images, full motion video, and combinations thereof. FIG. 1A showsa clock window and application icons as a representative example of theimage IM. However, the image IM displayed by the electronic device EA isnot limited to these representative examples.

In the present exemplary embodiment, front (or upper) and rear (orlower) surfaces of each member are defined with respect to a directionin which the image IM is displayed. The front and rear surfaces areopposite to each other in the third direction DR3, and a normal linedirection of each of the front and rear surfaces is substantiallyparallel to the third direction DR3. Directions indicated by the first,second, and third directions DR1, DR2, and DR3 are relative to eachother. Therefore, the directions indicated by the first, second, andthird directions DR1, DR2, and DR3 may be changed to other directionsthan those shown in the exemplary embodiments.

As shown in FIG. 1B, the electronic device EA includes the window WM, adisplay module 200, a driving circuit unit 300, a housing 400, and anelectronic module 500. In the present exemplary embodiment, the windowWM and the housing 400 are coupled to each other to define an interiorand an exterior of the electronic device EA.

The window WM includes an optically transparent insulating material. Forexample, in an exemplary embodiment, the window WM may include glass,plastic or combinations thereof. The window WM has a single-layer ormulti-layer structure. For example, the window WM with a multi-layerstructure includes a plurality of plastic films attached to each otherby an adhesive or includes a glass substrate and a plastic film attachedto the glass substrate by an adhesive.

The window WM may be divided into a transmission area TA and a bezelarea BZA when viewed in a plan view. In the present disclosure, theexpression “when viewed in a plan view” may mean a state of being viewedin the third direction DR3. In addition, the expression “thicknessdirection” may mean the third direction DR3.

The transmission area TA may be an optically transparent area. The bezelarea BZA may be an area having a light transmittance that is relativelylower than the transmission area TA. The bezel area BZA may be disposedadjacent to the transmission area TA and may surround the transmissionarea TA. The bezel area BZA may define a shape of the transmission areaTA.

The bezel area BZA may have a predetermined color. The bezel area BZAmay cover a non-active area NAA of the display module 200 to prevent thenon-active area NAA from being viewed from the outside by the user.However, in other exemplary embodiments of the present disclosure thebezel area BZA may be omitted from the window WM.

In an exemplary embodiment of the present disclosure, the window WMincludes a module area MA. The module area MA may overlap (e.g., in thethird direction DR3) with the electronic module 500 described later. Theelectronic device EA may receive external signals for input into theelectronic module 500 or may send signals output from the electronicmodule 500 to the outside (e.g., to an external device) through themodule area MA. According to an exemplary embodiment of the presentdisclosure, the module area MA may be disposed within the transmissionarea TA. Accordingly, as the module area MA moves from the bezel areaBZA to the transmission area TA, the width of the bezel area BZA maydecrease.

FIG. 1B shows one module area MA. However, exemplary embodiments of thepresent disclosure are not limited thereto. For example, the electronicdevice EA may include a plurality of module areas MA. Additionally, inthe exemplary embodiment shown in FIG. 1B, the module area MA ispositioned in a left upper end of the transmission area TA. However,exemplary embodiments of the present disclosure are not limited thereto.For example, the module area MA may be positioned in various other areasof the transmission area TA, such as a right upper end of thetransmission area TA, a center of the transmission area TA, a left lowerend of the transmission area TA, a right lower end of the transmissionarea TA, etc.

As shown in FIG. 1B, the display module 200 may be disposed under thewindow WM. In the present disclosure, the term “under” may mean adirection (e.g., in the third direction DR3) opposite to the directionin which the display module 200 displays the image IM. The displaymodule 200 may display the image IM and may sense an external input TC.The display module 200 may include a front surface IS (e.g., a topsurface of the display module in the third direction DR3) including anactive area AA and a non-active area NAA. The active area AA may beactivated in response to electrical signals.

In the present disclosure, the active area AA of the display module 200may be the area in which the image IM is displayed and the externalinput TC is sensed. The transmission area TA of the window WM mayoverlap (e.g., in the third direction DR3) with the active area AA. Forexample, the transmission area TA may overlap with at least a portion orthe entire surface of the active area AA. Therefore, the user may viewthe image IM through the transmission area TA or may input the externalinput TC through the transmission area TA.

The bezel area BZA of the window WM may overlap (e.g., in the thirddirection DR3) the non-active area NAA of the display module 200.Therefore, the non-active area NAA may be covered by the bezel area BZA.The non-active area NAA may be disposed adjacent to the active area AA.For example, the non-active area NAA may be disposed on the perimeter ofthe active area AA. The non-active area NAA may surround the active areaAA and define a shape of the active area AA. A driving circuit unit 300or a driving line may be disposed in the non-active area NAA to drivethe active area AA.

In the present exemplary embodiment, the display module 200 has a flatshape in the active area AA and the non-active area NAA. However,exemplary embodiments of the present disclosure are not limited thereto.For example, the display module 200 may be partially bent in thenon-active area NAA. In this embodiment, the display module 200 may bebent toward a rear surface of the electronic device EA in the non-activearea NAA. The bent portion of the display module 200 may overlap theactive area AA (e.g., in the third direction DR3) and may be disposedbelow the active area AA. In this embodiment, the bezel area BZA of thewindow WM may not overlap the bent portion of the display module 200 andthe area of the bezel area BZA may be reduced in the display surface FSof the electronic device FA. In another exemplary embodiment, thedisplay module 200 may have a partially-bent shape in the active areaAA. In another exemplary embodiment, the non-active area NAA may beomitted from the display module 200.

The display module 200 includes a display panel 210 and an input sensinglayer 220.

The display panel 210 may be configured to substantially generate theimage IM. The display panel 210 may display the generated image IMthrough the front surface IS. The user may view the image IM from theoutside through the transmission area TA of the window WM.

The input sensing layer 220 senses the external input TC provided fromthe outside. For example, the input sensing layer 220 may sense theexternal input TC provided through the window WM. The external input TCmay be a user input. The user input may include various forms ofexternal inputs, such as a portion of the user's body, light, heat, pen,pressure, etc. In the exemplary embodiment shown in FIG. 1A, theexternal input TC is shown as a touch operation using the user's handapplied via the display surface FS of the electronic device EA. However,exemplary embodiments of the present disclosure are not limited thereto.As described above, the external input TC may be provided in variousforms, and the electronic device EA may sense the external input TCapplied to the electronic device EA depending on a structure of theelectronic device EA.

The driving circuit unit 300 may be electrically connected to thedisplay panel 210 and the input sensing layer 220. The driving circuitunit 300 may include a main circuit board MB, a first flexible film CF1,and a second flexible film CF2.

The first flexible film CF1 is electrically connected to the displaypanel 210. The first flexible film CF1 connects the display panel 210and the main circuit board MB. The first flexible film CF1 is connectedto pads (e.g., display pads) of the display panel 210, which arearranged in the non-active area NAA. The first flexible film CF1provides the display panel 210 with electrical signals to drive thedisplay panel 210. The electrical signals are generated by the firstflexible film CF1 or the main circuit board MB.

The second flexible film CF2 is electrically connected to the inputsensing layer 220. The second flexible film CF2 connects the inputsensing layer 220 and the main circuit board MB. The second flexiblefilm CF2 is connected to pads (e.g., sensing pads) of the input sensinglayer 220, which are arranged in the non-active area NAA. The secondflexible film CF2 provides the input sensing layer 220 with electricalsignals to drive the input sensing layer 220. The electrical signals aregenerated by the second flexible film CF2 or the main circuit board MB.

The main circuit board MB may include various driving circuits thatdrive the display module 200. The main circuit board MB may also includea connector used to supply a power. The first flexible film CF1 and thesecond flexible film CF2 may be connected to the main circuit board MB.According to an exemplary embodiment of the present disclosure, thedisplay module 200 may be controlled by using one main circuit board MB.However, in other exemplary embodiments, the display module 200 mayinclude a plurality of circuit boards. For example, the display panel210 and the input sensing layer 220 may be connected to different maincircuit boards from each other and one of the first flexible film CF1and the second flexible film CF2 may not be connected to the maincircuit board MB.

In the exemplary embodiment of the present disclosure, an area of thedisplay module 200 overlapping (e.g., in the third direction DR3) themodule area MA of the window WM may have a relatively highertransmittance than the active area AA that does not overlap with themodule area MA. For example, at least some of components of the displaypanel 210 and components of the input sensing layer 220 may be omittedin this area. Accordingly, the electronic module 500 disposed to overlapwith the module area MA may easily transmit and/or receive signalsthrough the module area MA.

FIG. 1B shows a structure in which a predetermined hole MH (hereinafter,referred to as “module hole”) is defined in an area of the displaymodule 200 overlapping (e.g., in the third direction DR3) the modulearea MA. The module hole MH is defined in the active area AA topenetrate through the display module 200. The module hole MH penetratesthrough the display panel 210 and the input sensing layer 220. Themodule hole MH may be defined by the absence of components of thedisplay panel 210 and the components of the input sensing layer 220 inthe regions overlapping (e.g., in the third direction DR3) with themodule area MA. Since the module hole MH is defined in the active areaAA of the display module, the module area MA of the window WM may beprovided in the transmission area TA.

When viewed in a plan view, the electronic module 500 may overlap withthe module hole MH and the module area MA. The electronic module 500 maybe disposed under the display module 200, and at least a portion of theelectronic module 500 may be received in the module hole MH. Theelectronic module 500 may receive the external input provided throughthe module area MA or may provide an output through the module area MA.

The housing 400 is coupled to the window WM. The housing 400 is coupledto the window WM to form an exterior surface for the electronic deviceEA which defines an inner space. The display module 200 and theelectronic module 500 may be positioned within the inner space.

The housing 400 may include a material with a relatively high rigidity.For example, in an exemplary embodiment, the housing 400 may include aplurality of frames and/or plates containing glass, plastic, metal, orcombinations thereof. The housing 400 may stably protect the componentsof the electronic device EA that are positioned within the inner spacefrom external impacts.

Referring to FIG. 2, the electronic device EA includes the displaymodule 200, a power supply module PM, a first electronic module EM1, anda second electronic module EM2. The display module 200, the power supplymodule PM, the first electronic module EM1, and the second electronicmodule EM2 are electrically connected to each other.

The power supply module PM supplies a power sufficient for the overalloperation of the electronic device EA. The power supply module PMincludes a conventional battery module.

The first electronic module EM1 and the second electronic module EM2include various functional modules to operate the electronic device EA.

The first electronic module EM1 is directly mounted on a mother boardelectrically connected to the display module 200 or is electricallyconnected to the mother board through a connector (not shown) afterbeing mounted on a separate board.

The first electronic module EM1 includes a control module CM, a wirelesscommunication module TM, an image input module IIM, an audio inputmodule AIM, a memory MM, and an external interface IF. Some of themodules are electrically connected to the mother board through aflexible printed circuit board without being mounted on the motherboard.

The control module CM controls the overall operation of the electronicdevice EA. In an exemplary embodiment, the control module CM may be amicroprocessor. However, exemplary embodiments are not limited thereto.For example, the control module CM activates or deactivates the displaymodule 200. The control module CM controls other modules, such as theimage input module IIM or the audio input module AIM, based on a touchsignal provided from the display module 200.

The wireless communication module TM may transmit/receive a wirelesssignal to/from another terminal by using a Bluetooth or Wi-Fi line. Thewireless communication module TM may transmit/receive a voice signal byusing a conventional communication line. The wireless communicationmodule TM may include a transmitter TM1 that modulates a signal to betransmitted and transmits the modulated signal and a receiver TM2 thatdemodulates the signal applied thereto.

The image input module IIM processes an image signal and converts theimage signal into image data that may be displayed through the displaymodule 200. The audio input module AIM receives an external audio signalthrough a microphone in a recording mode and a voice recognition modeand converts the audio signal into electrical voice data.

The external interface IF serves as an interface between the controlmodule CM and external devices, such as an external charger, awired/wireless data port, and a card socket (e.g., a memory card and aSIM/UIM card).

The second electronic module EM2 includes an audio output module AOM, alight emitting module LM, a light receiving module LRM, and a cameramodule CMM. The components of the second electronic module EM2 aredirectly mounted on the mother board, electrically connected to thedisplay module 200 through a connector after being mounted on a separatesubstrate, or electrically connected to the first electronic module EM1.

The audio output module AOM converts and outputs the audio data providedfrom the wireless communication module TM or the audio data stored inthe memory MM to a speaker or an external device.

The light emitting module LM may generate and emit a light. For example,in an exemplary embodiment, the light emitting module LM may emit aninfrared light. The light emitting module LM may include a lightemitting diode (LEI)) device. The light receiving module LRM may sensethe infrared light. The light receiving module LRM may be activated whensensing the infrared light equal to or greater than a predeterminedlevel. The light receiving module LRM may include a complementary metaloxide semiconductor (CMOS) sensor. The infrared light generated by thelight emitting module LM may be incident into the light receiving moduleLRM after being output from the light emitting module LM and beingreflected by an external object, such as a user's finger or face. Thecamera module CMM may photograph an external image.

In an exemplary embodiment, the electronic module 500 may include atleast one of the components of the first electronic module EM1 and thesecond electronic module EM2. For example, the electronic module 500 mayinclude at least one of the audio output module AOM, the light emittingmodule LM, the light receiving module LRM, the camera module CMM, and aheat sensing module. The electronic module 500 may sense an externalsubject provided through the module area MA or may provide a soundsignal such as a voice or a light such as an infrared light to theoutside. In addition, the electronic module 500 may include a pluralityof modules, however, it should not be limited to a particularembodiment.

FIG. 3 is a plan view showing the display panel 210 according to anexemplary embodiment of the present disclosure, and FIG. 4 is anenlarged plan view showing an area XX′ shown in FIG. 3.

Referring to FIGS. 3 and 4, the display panel 210 includes a base layerBL, a plurality of pixels PX, a plurality of signal lines GL, DL, andPL, and a plurality of display pads PDD.

The active area AA of the display panel 210 is an area in which theimage IM is displayed, and the non-active area NAA is an area in whichthe driving circuit 300 or the driving line is disposed. FIG. 3 showsthe active area AA and the non-active area NAA of the display panel 210.The pixels PX are disposed in the active area AA.

The base layer BL may be a stack structure. For example, the base layerBL may include a silicon substrate, a plastic substrate, a glasssubstrate, an insulating film, or a plurality of insulating layers.

The active area AA may include a first area AR1 and a second area AR2.When viewed in a plan view, the second area AR2 may surround the firstarea AR1. The second area AR2 may be the display area in which the imageis displayed and may be surrounded by the non-active area NAA. Thepixels PX may be disposed on the base layer BL to correspond to thesecond area AR2.

At least a portion of the first area AR1 may overlap with the modulearea MA of the window WM when viewed in a plan view. The module hole MHmay be defined within the first area AR1. For example, the module holeMH may be defined by partially or entirely removing the components ofthe display panel 210 and may be disposed to overlap with the modulearea MA of the window WM. The first area AR1 may also include theportion of the active area AA immediately surrounding the module hole MHwhen viewed in a plan view.

The pixels PX that provide the image may not be disposed on the firstarea AR1 of the base layer BL. Accordingly, the first area AR1 may bedefined as a non-display area within the active area AA. The pixels PXmay be disposed on the second area AR2 of the base layer BL. Therefore,the second area AR2 may be defined as a display area in the active areaAA.

According to the present disclosure, the non-display area AR1 may bedisposed to be surrounded by the display area AR2 when viewed in a planview. As shown in FIG. 1B, the non-display area AR1 may overlap with themodule area MA of the window WM. Therefore, the first area AR1 mayobviate the need for a separate area outside the active area AA toprovide module areas. Accordingly, areas outside the active area AA formodules may be omitted in the electronic device EA and the sizes of thenon-active area NAA and the bezel area BZA may be reduced.

Various signal lines are connected to the pixels PX to apply electricalsignals to the pixels PX. For example, in the exemplary embodiment shownin FIG. 3, the signal lines included in the display panel 210 are a scanline GL, a data line DL, and a power line PL. However, exemplaryembodiments of the present disclosure are not limited thereto. In otherexemplary embodiments, the signal lines may further include at least oneof an initialization voltage line, a light emitting control line, etc.The signal lines GL, DL, and PL may be disposed on the second area AR2of the base layer BL.

In the exemplary embodiment shown in FIG. 3, an equivalent circuitdiagram of one pixel PX among the pixels PX is enlarged and shown as arepresentative example. The pixel PX may include a first transistor TR1,a capacitor CIP, a second transistor TR2, and a light emitting deviceOLED. The first transistor TR1 may be a switching device that controlsan ON/OFF of the pixel PX. The first transistor TR1 may transmit orblock a data signal applied thereto through the data line DL in responseto a scan signal applied thereto through the scan line GL.

The capacitor CP is connected to the first transistor TR1 and the powerline PL. The capacitor CP is charged with electric charges correspondingto an electric potential difference between the data signal providedfrom the first transistor TR1 and a first power signal (hereinafter, the“first power signal”) applied to the power line PL.

The second transistor TR2 is connected to the first transistor TR1, thecapacitor CP, and the light emitting device OLED. The second transistorTR2 controls a driving current flowing through the light emitting deviceOLED in response to an amount of the electric charges charged in thecapacitor CP. A turn-on time of the second transistor TR2 is determinedby the amount of the electric charges charged in the capacitor CP. Thesecond transistor TR2 applies the first power signal provided throughthe power line PL to the light emitting device OLED during its turn-ontime.

The light emitting device OLED may generate light or may control anamount of the light that is generated in response to the electricalsignals. In an exemplary embodiment, the light emitting device OLED mayinclude an organic light emitting device or a quantum dot light emittingdevice.

The light emitting device OLED is connected to a power terminal VSS toreceive a power signal (hereinafter, referred to as “second powersignal”) different from the first power signal provided through thepower line PL. The driving current corresponding to a difference betweenthe electrical signals provided from the second transistor TR2 and thesecond power signal flows through the light emitting device OLED. Thelight emitting device OLED generates the light corresponding to thedriving current. However, the light emitting device described above ismerely exemplary. The pixel PX may include electronic devices havingvarious different configurations and arrangements as compared to thedescribed exemplary embodiment and should not be particularly limited.

The display pads PDD may include a first pad D1 and a second pad D2. Thefirst pad D1 may include a plurality of first pads and the first pads D1may be connected to the data lines DL. The second pad D2 may beelectrically connected to the power line PL. The display panel 210 mayapply the electrical signals provided thereto from the outside throughthe display pads PDD to the pixels PX. The display pads PDD may furtherinclude additional pads to receive other electrical signals aside fromthe first pad D1 and the second pad D2 and the display pads PDD shouldnot be limited to the exemplary embodiment shown in FIG. 3.

FIG. 5 is a plan view showing the input sensing layer 220 according toan exemplary embodiment of the present disclosure.

Referring to FIG. 5, the input sensing layer 220 may be disposed on thedisplay panel 210. For example, in an exemplary embodiment, the inputsensing layer 220 may be directly disposed on the display panel 210 ormay be coupled to the display panel 210 by an adhesive member. The inputsensing layer 220 may be formed on the display panel 210 throughsuccessive processes after the display panel 210 is formed.

In an exemplary embodiment, the input sensing layer 220 may include afirst sensing electrode TE1, a second sensing electrode TE2, a pluralityof sensing lines TL1, TL2, and TL3, and a plurality of sensing pads PDT.However, other exemplary embodiments may have different numbers andarrangements of sensing electrodes TE1 and TE2, sensing lines TL1 andTL2 and sensing pads PDT. Accordingly, exemplary embodiments of thepresent disclosure are not limited thereto.

The first sensing electrode TE1 and the second sensing electrode TE2 aredisposed in the active area AA. For example, as shown in the exemplaryembodiment of FIG. 5, the first sensing electrode TE1 and second sensingelectrode TE2 are arranged in an array of rows and columns with thefirst sensing electrode TE1 and second sensing electrode TE2 alternatingin adjacent columns. The input sensing layer 220 may obtain informationon the external input TC (refer to FIG. 1A) based on a variation incapacitance between the first sensing electrode TE1 and the secondsensing electrode TE2.

The first sensing electrode TE1 includes first sensing patterns SP1 andfirst connection patterns BP1. At least one first connection pattern BP1is connected to two first sensing patterns SP1 that are positionedadjacent to each other. The second sensing electrode TE2 includes secondsensing patterns SP2 and second connection patterns BP2. At least onesecond connection pattern BP2 is connected to two second sensingpatterns SP2 that are adjacent to each other.

The sensing lines are mainly disposed in the non-active area NAA. In theexemplary embodiment shown in FIG. 5, the sensing lines include a firstsensing line TL1, a second sensing line TL2, and a third sensing lineTL3.

The first sensing line TL1 is connected to the first sensing electrodeTE1. The second sensing line TL2 is connected to a first end of thesecond sensing electrode TE2. The third sensing line TL3 is connected toa second end of the second sensing electrode TE2. The first end of thesecond sensing electrode TE2 is opposite to the second end of the secondsensing electrode TE2. For example, the first end of the second sensingelectrode TE2 may be spaced apart from the second end of the secondsensing electrode TE2 in the second direction DR2.

According to the present disclosure, the second sensing electrode TE2 isconnected to the second sensing line TL2 and the third sensing line TL3.Accordingly, a sensitivity with respect to an area of the second sensingelectrode TE2, which has a longer length than the first sensingelectrode TE1, may be uniformly maintained. However, exemplaryembodiments of the present inventive concepts are not limited to thisparticular configuration. For example, in other exemplary embodiments,the third sensing line TL3 may be omitted.

The sensing pads PDT are disposed in the non-active area NAA. In theexemplary embodiment shown in FIG. 5, the sensing pads PDT include afirst sensing pad T1, a second sensing pad T2, and a third sensing padT3. However, exemplary embodiments of the present disclosure are notlimited thereto. The first sensing pad T1 is connected to the firstsensing line TL1 and electrically connected to the first sensingelectrode TE1. The second sensing pad T2 is connected to the secondsensing line TL2, and the third sensing pad T3 is connected to the thirdsensing line TL3. Therefore, the second sensing pad T2 and the thirdsensing pad T3 are electrically connected to the second sensingelectrode TE2.

Some of the components of the input sensing layer 220 may be removedfrom an area overlapping (e.g., in the third direction DR3) the modulearea MA of the window WM. For example, a portion of the first sensingelectrode TE1 and a portion of the second sensing electrode TE2 may notbe disposed in the area overlapping the module area MA. In the presentexemplary embodiment, the first sensing electrode TE1 may have theportion of the first sensing pattern that overlaps with the module areaMA removed and the second sensing electrode TE2 may have the portion ofthe second sensing pattern that overlaps with the module area MAremoved.

According to the present disclosure, since the sensing electrodes TE1and TE2 are removed in the area overlapping with the module area MA, theelectronic module 500 (refer to FIG. 1B) may be prevented from beingcovered by the first sensing electrode TE1 or the second sensingelectrode TE2. Therefore, the sensing sensitivity of the electronicmodule 500 may be improved.

FIG. 6 is an exploded perspective view showing a module area and modulehole of an electronic device according to an exemplary embodiment of thepresent disclosure, and FIG. 7 is a cross-sectional view taken along aline I-I′ shown in FIG. 6.

Referring to FIGS. 6 and 7, the window WM provides the front surface ofthe electronic device EA (e.g., a top surface of the electronic devicein the third direction DR3). The window WM is disposed on the entiresurface of the display module 200 (e.g., in a plane defined by the firstdirection DR1 and second direction DR2) to protect the display module200. In an exemplary embodiment, the window WM may include a glasssubstrate, a sapphire substrate, a plastic film, etc.

The window WM may include a transparent material and provides thetransmission area TA and the bezel area BZA of the electronic device EA.According to the present exemplary embodiment, the transmission area TAof the window WM may be an area overlapping the display area DA of thedisplay panel 210. For example, the transmission area TA may overlappartially or with the entire portion of the display area DA. The imageIM displayed through the display area DA of the display panel DP may beviewed by the user from the outside through the transmission area TA.

The window WM may further include a bezel layer BZ. The bezel layer BZmay define the bezel area BZA. For example, in the present exemplaryembodiment, an area in which the bezel layer BZ is disposed on thewindow WM may be defined as the bezel area BZA, and an area that isexposed and is not covered by the bezel layer BZ may be the transmissionarea TA. The bezel layer BZ may include a pattern layer that provides apredetermined pattern and an achromatic layer. The pattern layer mayprovide a pattern called a hair line. The achromatic layer may includean organic mixture containing a black pigment or dye. In an exemplaryembodiment, the bezel layer BZ may be formed by a depositing, printing,or coating method.

The window WM may further include a window black matrix WBM. In anexemplary embodiment, the window black matrix WBM may be printed on arear surface of the window WM (e.g., the bottom surface of the window inthe third direction DR3). The window black matrix WBM may be printed tohave a color with a high light shielding property. In an exemplaryembodiment, the window black matrix WBM may include an organic mixturecontaining a black pigment or dye. However, the window black matrix WBMmay be any material having a high light shielding property.

The window black matrix WBM may be positioned within the module area MAof the window WM and may not overlap (e.g., in the third direction DR3)with the module hole MH. For example, the window black matrix WBM may bepositioned within a peripheral area PA of the module area MA whichoverlaps a portion of the display module 200 that surrounds the modulehole MH. The window black matrix WBM prevents a light passing throughthe module hole MH from leaking in a peripheral area of the module holeMH and from passing through the transmission area TA of the window WMfor viewing by the user.

According to an exemplary embodiment of the present disclosure, themodule area MA of the window WM may include a center area CA whichoverlaps (e.g., in the third direction DR3) the module hole MH and theperipheral area PA. The window black matrix WBM is disposed in theperipheral area PA. The window black matrix WBM may be disposed in theperipheral area PA to prevent a light leakage phenomenon in which thelight leaks from the peripheral area PA.

An anti-glare layer may be further disposed between the window blackmatrix WBM and the window WM or between the window black matrix WBM andthe display module 200. The anti-glare layer may be disposed in theperipheral area PA of the module area MA or areas overlapping therewithto prevent a glare phenomenon due to the light leaking from theperipheral area PA.

The electronic device EA may include one or more functional layers FLdisposed between the window WM and the display module 200. For example,in the exemplary embodiment of FIG. 7, the functional layer FL may be ananti-reflection layer that shields external light reflection. Theanti-reflection layer may prevent the external light incident throughthe display surface FS of the electronic device EA from being viewedfrom the outside by the user after being reflected by elements of thedisplay module 200. The anti-reflection layer may include a polarizationfilm and/or a retardation film. The number of the retardation films anda phase retardation length (e.g., λ/4 or λ/2) of the retardation filmmay vary. For example, the number of the retardation films and a phaseretardation length may be determined according to an operation principleof the anti-reflection layer.

The window WM and the functional layer FL may be attached to each otherby a first adhesive layer AL1. The first adhesive layer AL1 may beoptically clear. The first adhesive layer AL1 may be an adhesive layermanufactured by coating a liquid adhesive material and curing the liquidadhesive material or an adhesive sheet separately manufactured. Forexample, the first adhesive layer AL1 may be a pressure sensitiveadhesive (PSA), an optical clear adhesive (OCA), or an optical clearresin (OCR).

A first opening OP1 may be defined through the first adhesive layer AL1to overlap the module hole MH (e.g., in the third direction DR3). Forexample, the first opening OP1 may be formed through the first adhesivelayer AL1 and may overlap the center area CA of the module area MA. Thefirst opening OP1 may have a size that is substantially the same size asthe module hole MH of the display module 200. As an example, a diameterof the first opening OP1 may be substantially the same as a diameter ofthe module hole MH. The electronic module 500 may be disposed within thespace provided by the first opening OP1 along with the space provided bythe module hole MH of the display module 200.

The functional layer FL may be fixed to the rear surface of the windowWM by the first adhesive layer AL1. A second opening OP2 may be definedthrough the functional layer FL to overlap the module hole MH (e.g., inthe third direction DR3). The second opening OP2 may be formed throughthe functional layer FL and may overlap the center area CA of the modulearea MA. The second opening OP2 may have a size that is substantiallythe same as the module hole MH. As an example, a diameter of the secondopening OP2 may be substantially the same as the diameter of the modulehole MH. The electronic module 500 may be disposed within the spaceprovided by the second opening OP2 along with the spaces provided by thefirst opening OP1 and the module hole MH of the display module 200.

The functional layer FL may be attached to the upper surface (e.g., inthe third direction DR3) of the display module 200 by a second adhesivelayer AL2 disposed on the upper surface of the display module. Thesecond adhesive layer AL2 may be optically clear. The second adhesivelayer AL2 may be an adhesive layer manufactured by coating a liquidadhesive material and curing the liquid adhesive material or an adhesivesheet separately manufactured. For example, in an exemplary embodiment,the second adhesive layer AL2 may be a pressure sensitive adhesive(PSA), an optical clear adhesive (OCA), or an optical clear resin (OCR).

A third opening OP3 may be defined through the second adhesive layer AL2to overlap the module hole MH (e.g., in the third direction DR3). Thethird opening OP3 may be formed through the second adhesive layer AL2and may overlap the center area CA of the module area MA. The thirdopening OP3 may have a size that is substantially the same size as themodule hole MH of the display module 200. As an example, a diameter ofthe third opening OP3 may be substantially the same as the diameter ofthe module hole MH. The electronic module 500 may be disposed within thespace provided by the third opening OP3 along with the spaces providedby the first and second openings OP1, OP2 and the module hole MH of thedisplay module 200.

The module hole MH may be formed through the display module 200. Themodule hole MH may overlap (e.g., in the third direction DR3) with thefirst to third openings OP1 to OP3 and with the center area CA of themodule area MA. The module hole MH may provide the space in which theelectronic module 500 is disposed together with the first to thirdopenings OP1 to OP3. Accordingly, the electronic module 500 may beinserted into the space and may be stably fixed therein.

In FIG. 7, the first to third openings OP1 to OP3 and the module hole MHhave substantially the same size as each other. However, exemplaryembodiments of the present disclosure are not limited thereto. Forexample, the first to third openings OP to OP3 may have a size, such asa diameter defined in the first direction DR1 and/or second directionDR2), that is greater than that of the module hole MH. In an exemplaryembodiment, the diameter of the first to third openings OP1 to OP3 maybe designed to increase as a distance of the respective opening to themodule hole MH increases in the third direction DR3. However, in anotherexemplary embodiment, the diameter of the first to third openings OP1 toOP3 may decrease as a distance of the respective opening to the modulehole MH increases in the third direction DR3.

FIG. 8 is a cross-sectional view showing a module area of an electronicdevice according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 8, a second opening OP2 may be defined through thefunctional layer FL to overlap the module hole MH (e.g., in the thirddirection DR3). First and second light blocking layers LBL1 and LBL2 maybe disposed in the peripheral area adjacent the second opening OP2. Thefirst light blocking layer LBL1 may be disposed on an upper surface(e.g., in the third direction DR3) of the functional layer FL and mayoverlap with the peripheral area PA of the module area MA, such as inthe third direction DR3. The second light blocking layer LBL2 may bedisposed on a lower surface (e.g., in the third direction DR3) of thefunctional layer and may overlap with the peripheral area PA of themodule area MA, such as in the third direction DR3.

As an example, the first and second light blocking layers LBL1 and LBL2may be black matrix layers respectively formed on the upper and lowersurfaces of the functional layer FL. In an exemplary embodiment, thefirst and second light blocking layers LBL1 and LBL2 may be respectivelyformed on the upper and lower surfaces of the functional layer FL by aprinting, depositing, or coating method. The first and second lightblocking layers LBL1 and LBL2 may include the organic material or themetal material having the light blocking property. The first and secondlight blocking layers LBL1 and LBL2 may have a circular ring shape andmay have a size (e.g., a diameter in the first direction DR1 and/orsecond direction DR2) that is smaller than that of the window blackmatrix WBM. For example, as shown in FIG. 8, the first and second lightblocking layers LBL1 and LBL2 have a width W1 (e.g., a length in thefirst direction DR1) that is smaller than the width W2 (e.g., a lengthin the first direction DR1) of the window black matrix WBM.

In the present exemplary embodiment, the first and second light blockinglayers LBL1 and LBL2 have a smaller size than that of the window blackmatrix WBM, however, they should not be limited thereto or thereby. Forexample, the first and second light blocking layers LBL1 and LBL2 mayhave substantially the same size as the window black matrix WBM. Inanother exemplary embodiment one of the first light blocking layer LBL1and the second light blocking layer LBL2 may have substantially the samesize as the window black matrix WBM, and the other of the first lightblocking layer and the second light blocking layer may have a smallersize than that of the window black matrix WBM.

In an exemplary embodiment, an anti-glare layer may be disposed adjacentto one of the first and second light blocking layers LBL1 and LBL2.

In another exemplary embodiment, the electronic device EA may include ananti-glare layer on the lower surface of the functional layer FL.

FIG. 9 is an exploded perspective view showing a module area of anelectronic device according to another exemplary embodiment of thepresent disclosure, and FIG. 10 is a cross-sectional view taken along aline II-II′ shown in FIG. 9.

Referring to FIGS. 9-10, the window WM may further include a windowblack matrix WBM disposed in the module area MA. The window black matrixWBM may be printed on a rear surface (e.g., the bottom surface in thethird direction DR3) of the window WM in the peripheral area PA. Thewindow black matrix WBM may be printed to have a color with a high lightshielding property. The window black matrix WBM may be any materialhaving a high light shielding property.

A second adhesive layer AL2, a functional layer FL, and a first adhesivelayer AL1 may be sequentially stacked in the third direction DR3 betweenthe window WM and the display module 200. A first opening OP1 is definedthrough the first adhesive layer AL1 to overlap the module hole MH, asecond opening OP2 is defined through the functional layer FL, and athird opening OP3 is defined through the second adhesive layer AL2. Thefirst to third openings OP1 to OP3 have a size (e.g., a length in thefirst direction DR1 and/or second direction DR2) greater than that ofthe module hole MH. For example, a diameter of the first to thirdopenings OP1 to OP3 is greater than a diameter of the module hole MH.The first to third openings OP1 to OP3 overlap with the peripheral areaPA of the module area MA (e.g., in the third direction DR3). The firstto third openings OP1 to OP3 provide a space, in which the electronicmodule 500 is disposed, together with the module hole MH of the displaymodule 200.

A light blocking layer BIL may be disposed inside the first to thirdopenings OP1 to OP3. The light blocking layer BIL may overlap (e.g., inthe third direction) with the peripheral area PA of the module area MA.As an example, in an exemplary embodiment, the light blocking layer BILmay be formed on an upper surface of the display module 200 exposedthrough the first to third openings OP1 to OP3 by an inkjet method. Thelight blocking layer BIL may include an organic mixture containing ablack dye or pigment. The light blocking layer BIL and the window blackmatrix WBM may have a circular ring shape, and the light blocking layerBIL may have a size smaller than that of the window black matrix WBM.For example, a width W3 in the first direction DR1 of the light blockinglayer BIL may be smaller than a width W4 in the first direction DR1 ofthe window black matrix WBM.

In the exemplary embodiment shown in FIGS. 9-10, the light blockinglayer BIL has a size (e.g., diameter in the first direction DR1 and/orsecond direction DR2) that is smaller than the size of the window blackmatrix WBM. However, exemplary embodiments of the present disclosure arelimited thereto. For example, the light blocking layer BIL may havesubstantially the same size as the window black matrix WBM. In certainembodiments, the light blocking layer BIL may have a size that isgreater than the size of the window black matrix WBM.

The light blocking layer BIL may be formed on the first area AR1 definedaround the module hole MH of the display module 200. In an exemplaryembodiment, the light blocking layer BIL may be formed by spraying anink on the upper surface of the display module 200 in a state in whichthe functional layer FL is attached on the upper surface of the displaymodule 200 by the second adhesive AL2. In another exemplary embodiment,the light blocking layer BIL may be formed by spraying the ink on theupper surface of the display module 200 to correspond to the first areaAR1 of the display module 200, and then the functional layer FL may besubsequently attached to the display module 200 by the second adhesivelayer AL2.

The light blocking layer BIL is disposed within the first to thirdopenings OP1 to OP3 and is between the window black matrix WBM and thedisplay module 200. As shown in FIG. 9, the light blocking layer BIL isformed to overlap (e.g., in the third direction DR3) with the peripheralarea PA of the module area MA. For example, the light blocking layer BILmay overlap with the first area AR1 of the display module. Therefore, alight leakage phenomenon in which the light leaks from the first areaAR1 may be prevented. Since the light blocking layer BIL extends withinthe inner areas of the first to third openings OP1 to OP3, the lightblocking layer BIL has a thickness greater than that of the lightblocking layers LBL, LBL1, and LBL2 shown in FIGS. 6 to 8 in the thirddirection DR3. Therefore, the light blocking layer BIL may have a higherlight blocking performance than the light blocking layers LBL, LBL1, andLBL2 shown in FIGS. 6 to 8, and as a result, there may be a greaterreduction in light leakage.

FIG. 11 is an exploded perspective view showing a module area of anelectronic device EA2 according to another exemplary embodiment of thepresent disclosure, and FIG. 12 is a cross-sectional view taken along aline III-III′ shown in FIG. 11.

Referring to FIGS. 1I and 12, a window WM may include a first modulearea MA1 and a second module area MA2 in the electronic device EA2according to another exemplary embodiment of the present disclosure. Thefirst module area MA1 of the electronic device EA2 has substantially thesame structure as the module area MA shown in FIGS. 6 to 10, and thusdetails thereof will be omitted.

The electronic device EA2 may further include a second window blackmatrix WBM2 disposed in the second module area MA2. The second modulearea MA2 may include a window module hole WMH overlapping (e.g., in thethird direction DR3) a second module hole MH2 disposed in the displaymodule 200 and a peripheral area PA2. The second window black matrixWBM2 may be printed on a rear surface of the window WM (e.g., the bottomsurface of the window in the third direction DR3) in the peripheral areaPA2. The second window black matrix WBM2 may be printed to have a colorwith a high light shielding property. For example, the second windowblack matrix WBM2 may include an organic mixture containing a blackpigment or dye. However, the second window black matrix WBM2 may be anymaterial having a high light shielding property.

A second adhesive layer AL2, a functional layer FL, and a first adhesivelayer AL1 may be sequentially stacked in the third direction DR3 betweenthe window WM and the display module 200. A fourth opening OP4 isdefined through the first adhesive layer AL1, a fifth opening OP5 isdefined through the functional layer FL, and a sixth opening OP6 isdefined through the second adhesive layer AL2. The fourth to sixthopenings OP4 to OP6 may overlap the second module hole MH2 (e.g., in thethird direction DR3). The fourth to sixth openings OP4 to OP6 havesubstantially the same size as the second module hole MH2 and the windowmodule hole WMH. For example, a diameter (e.g., in a plane defined inthe first direction DR1 and/or second direction DR2) of the fourth tosixth openings OP4 to OP6 is substantially the same as a diameter of thesecond module hole MH2. The fourth to sixth openings OP4 to OP6 providea space, in which an electronic module 600 is disposed, together withthe second module hole MH2 and the window module hole WMH. In thepresent exemplary embodiment, the electronic module 600 disposed in thesecond module area MA2 is an electronic module of a different type fromthe electronic module 500 disposed in the first module area MA1. Forexample, the electronic module 600 may be the audio output module AOM(refer to FIG. 2) that is required to be exposed to the outside throughthe window module hole WMH. However, exemplary embodiments of thepresent disclosure are not limited thereto.

A third light blocking layer LBL3 may be disposed around the fourthopening OP4. The third light blocking layer LBL3 may overlap (e.g., inthe third direction DR3) with the peripheral area PA2 of the secondmodule area MA2. As an example, the third light blocking layer LBL3 maybe a black matrix layer formed on an upper surface of the functionallayer FL by a printing, depositing, or coating method. The third lightblocking layer LBL3 may include an organic material or a metal materialhaving the light blocking property. The third light blocking layer LBL3and the second window black matrix WBM2 may have a circular ring shape,and the third light blocking layer LBL3 may have a size (e.g., adiameter in the first direction DR1 and/or second direction DR2) smallerthan the size of the second window black matrix WBM2. For example, awidth W5 in the first direction DR1 of the third light blocking layerLBL3 may be smaller than a width W6 in the first direction DR1 of thesecond window black matrix WBM2.

In the present disclosure, a structure in which the third light blockinglayer LBL3 has the size smaller than that of the second window blackmatrix WBM2 is shown as a representative example. However, exemplaryembodiments of the present disclosure are not limited thereto. Forexample, the third light blocking layer LBL3 may have substantially thesame size as the second window black matrix WBM2 or may have a greatersize than the second window black matrix WBM2.

The second module hole MH2 may be formed through the display module 200.The second module hole MH2 may overlap (e.g., in the third directionDR3) with the fourth to sixth openings OP4 to OP6 and may overlap withthe window module hole WMH of the second module area MA2. The electronicmodule 600 may be disposed in spaces formed by the second module holeMH2, the fourth to sixth openings OP4 to OP6 and the window module holeWMH. Accordingly, the electronic module 600 may be inserted into thespace and may be stably fixed therein.

In another exemplary embodiment, the fourth to sixth openings OP4 to OP6may have a diameter which accommodates a light blocking layer (e.g., acircular ring shape light blocking layer). The light blocking layer isdisposed in the inner space of the fourth to sixth openings OP4 to OP6and extends in the third direction DR3 from the fourth to sixth openingsOP4 to OP6. The electronic module 600 is disposed in the inner spacedefined by the light blocking layer.

FIG. 13 is a cross-sectional view showing an active area of a displaypanel 210 according to an exemplary embodiment of the presentdisclosure, and FIG. 14 is a cross-sectional view showing a module areaof an electronic device according to an exemplary embodiment of thepresent disclosure.

Referring to FIGS. 13 and 14, the display panel 210 includes a baselayer BL, a circuit device layer DP-CL disposed on the base layer BL, adisplay device layer DP-OLED disposed on the circuit device layer DL-CL,an encapsulation substrate EC, and a sealing member SM.

The base layer BL may include a glass substrate. The base layer BL mayinclude a substrate having a constant refractive index in a visiblelight wavelength range.

The circuit device layer DP-CL may include a buffer layer BFL, a firstintermediate inorganic layer CL1, and a second intermediate inorganiclayer CL2, which are inorganic layers, and an intermediate organic layerCL3 that is an organic layer. FIG. 13 shows an arrangement relation of asemiconductor pattern OSP, a control electrode GE, an input electrodeDE, and an output electrode SE, which form a first transistor TR1. Thecircuit device layer DP-CL may further include at least one contacthole. For example, first and second contact holes CH1 and CH2 are shownin the representative example of FIG. 13.

The display device layer DP-OLED includes a light emitting device OLED.The display device layer DP-OLED includes organic light emitting diodesas the light emitting device OLED. The display device layer DP-OLEDincludes a pixel definition layer PDL, e.g., an organic material.

A first electrode AE is disposed on the intermediate organic layer CL3.The first electrode AE is connected to the output electrode SE through athird contact hole CH3 defined through the intermediate organic layerCL3. An opening OP is defined through the pixel definition layer PDL. Atleast a portion of the first electrode AE is exposed through the openingOP of the pixel definition layer PDL. The opening OP of the pixeldefinition layer PDL is referred to as a “light emitting opening” todistinguish it from other openings.

A display area AR2 of the display panel 210 may include a light emittingarea PXA and a non-light emitting area NPXA defined adjacent to thelight emitting area PXA. The non-light emitting area NPXA may surroundthe light emitting area PXA. In the present exemplary embodiment, thelight emitting area PXA is defined to correspond to a portion of thefirst electrode AE exposed through the light emitting opening OP.

A hole control layer HCL may be commonly disposed on the light emittingarea PXA and the non-light emitting area NPXA. The hole control layerHCL may include a hole transport layer and may further include a holeinjection layer. A light emitting layer EML may be disposed on the holecontrol layer HCL. The light emitting layer EML may be disposed in anarea corresponding to the light emitting opening OP. The light emittinglayer EML may be formed in each of the pixels after being divided intoplural portions. The light emitting layer EML may include an organicmaterial and/or an inorganic material. The light emitting layer EML maygenerate a predetermined color light.

An electron control layer ECL may be disposed on the light emittinglayer EML. The electron control layer ECL may include an electrontransport layer and may further include an electron injection layer. Thehole control layer HCL and the electron control layer ECL may becommonly formed in a plurality of the pixels using an open mask. Asecond electrode CE may be disposed on the electron control layer ECL.The second electrode CE may be commonly disposed in a plurality of thepixels.

A protective layer PIL may be further disposed on the display devicelayer DP-OLED. The protective layer PIL, may protect the secondelectrode CE of the light emitting devices OLED. The protective layerPIL may include an inorganic material, such as silicon oxide, siliconnitride, silicon oxynitride, etc.

The encapsulation substrate EC may be disposed on the second electrodeCE. The encapsulation substrate EC and the second electrode CE may bespaced apart from each other (e.g., in the third direction DR3). A gapGP between the encapsulation substrate EC and the second electrode CEmay be filled by air or inert gas. In addition, the gap GP may be filledwith a filler, such as a silicone-based polymer, an epoxy-based resin,an acrylic-based resin, etc.

The encapsulation substrate EC may be transparent. The encapsulationsubstrate EC may include a glass substrate. The encapsulation substrateEC may include a substrate having a constant refractive index in avisible light wavelength range.

The stack structure of the base layer BL, the circuit device layerDP-CL, and the display device layer DP-OLED may be defined as a lowerdisplay substrate. The sealing member SM may couple the lower displaysubstrate and the encapsulation substrate EC. The sealing member SM mayextend along an edge of the encapsulation substrate EC. The sealingmember SM may overlap (e.g., in the third direction DR3) with thenon-active area NAA (refer to FIG. 3) of the display panel 210.

As shown in FIG. 14, the sealing member SM may overlap with thenon-display area AR1 of the display panel 210. The pixel is not formedin the non-display area AR1 of the display panel 210. The non-displayarea AR1 of the display panel 210 may overlap with the module area MA ofthe electronic device EA shown in FIG. 1A.

The encapsulation substrate EC and the sealing member SM may preventmoisture from entering the lower display substrate. In the exemplaryembodiment of the present disclosure, the sealing member SM may couplean upper surface (e.g., in the third direction DR3) of the base layer BLand a lower surface of the encapsulation substrate EC to each other.

In an exemplary embodiment, the sealing member SM may include aninorganic adhesive member such as a frit. However, in other exemplaryembodiments, the sealing member SM may include an organic adhesivemember. In the present exemplary embodiment, since the display panel 210is completely sealed from the outside, a strength of the display panel210 may be improved, and defects of the light emitting device may beprevented.

The display module 200 may further include a fourth light blocking layerLBL4 disposed on the upper surface of the display panel 210 tocorrespond to the first area AR1 defined around the module hole MH. Forexample, the fourth light blocking layer LBL4 may be disposed on theupper surface of the encapsulation substrate EC. As an example, thefourth light blocking layer LBL4 may be a black matrix layer formed onthe upper surface of the encapsulation substrate EC by a printing,depositing, or coating method. The fourth light blocking layer LBL4 mayinclude an organic material or a metal material having the lightblocking property. The fourth light blocking layer LBL4 and the windowblack matrix WBM may have a circular ring shape, and the fourth lightblocking layer LBL4 may have a size (e.g., a diameter in the firstdirection DR1 and/or second direction DR2) that is smaller than that ofthe window black matrix WBM. For example, a width W7 in the firstdirection DR1 of the fourth light blocking layer LBL4 may be smallerthan a width W8 in the first direction DR1 of the window black matrixWBM.

In the present exemplary embodiment, the fourth light blocking layerLBL4 has a size that is smaller than that of the window black matrixWBM. However, exemplary embodiments of the present disclosure are notlimited thereto. For example, the fourth light blocking layer LBL4 mayhave substantially the same size as the window black matrix WBM.

As shown in FIG. 14, when the display module 200 includes the fourthlight blocking layer LBL4, the light blocking layer LBL (refer to FIGS.6 to 8) may not be disposed on at least one surface of the upper andlower surfaces of the functional layer FL. However, in another exemplaryembodiment, the electronic device may include both a fourth lightblocking layer LBL4 and at least one additional light blocking layerLBL.

The fourth light blocking layer LBL4 may be formed to overlap with theperipheral area of the module hole MH, such as the first area AR1, toprevent light leakage from the first area AR1.

FIG. 15 is a cross-sectional view showing a module area of an electronicdevice according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 15, a display panel 210 may include a light blockingsealing member BSM overlapping (e.g., in the third direction DR3) withthe non-display area AR1 of the display panel 210. The light blockingsealing member BSM may be a sealing member having a light blockingproperty. The light blocking sealing member BSM may include an adhesivemember and an organic mixture containing a black dye or pigment.

In an exemplary embodiment, the light blocking sealing member BSM mayoverlap with the non-active area NAA (refer to FIG. 3) of the displaypanel 210. The light blocking sealing member BSM may extend from anupper surface of the base layer BL to a lower surface of theencapsulation substrate EC. However, in another exemplary embodiment,the light blocking sealing member BSM may be disposed in the non-displayarea AR1 of the display panel, and the sealing member SM shown in FIG.14 may be disposed in the non-active area NAA.

As shown in FIG. 15, a light blocking layer LBL may be disposed on anupper surface of the functional layer FL. However, exemplary embodimentsof the present disclosure are not limited thereto. For example, in anexemplary embodiment in which the light blocking sealing member BSM isincluded in the display panel 210, the device may include the first andsecond light blocking layers LBL1 and LBL2 (refer to FIG. 8)respectively disposed on the upper and lower surfaces of the functionallayer FL and the light blocking layer BIL (refer to FIGS. 9 and 10)sprayed on the upper surface of the display module 200.

Accordingly, the light blocking sealing member BSM may prevent theleakage of light passing through the module hole MH from the first areaAR1 defined around the module hole MH. In addition, since the leakedlight is blocked again by the window black matrix WBM and the lightblocking layer LBL, the phenomenon in which the light leaked from theperipheral area AR1 of the module hole MH is viewed from the outside bythe user.

Although the exemplary embodiments of the present disclosure have beendescribed, it is understood that the present disclosure should not belimited to these exemplary embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present disclosure as hereinafter claimed.Therefore, the disclosed subject matter should not be limited to anysingle embodiment described herein.

What is claimed is:
 1. An electronic device comprising: a display modulehaving an active area in which pixels are disposed and a non-activearea, in which pixels are not disposed, adjacent to the active area, theactive area including a module hole; a window disposed on the displaymodule; a functional layer disposed between the display module and thewindow, the functional layer including a first opening definedtherethrough that overlaps with the module hole; a light blocking layerdisposed on at least one of upper and lower surfaces of the functionallayer and positioned adjacent to the first opening; and an electronicmodule disposed in an opening formed by at least one of the module holeand the first opening.
 2. The electronic device of claim 1, wherein thelight blocking layer comprises a first light blocking layer disposed onthe upper surface of the functional layer and positioned adjacent to thefirst opening.
 3. The electronic device of claim 2, further comprising:an adhesive layer disposed between the upper surface of the functionallayer and the window, the adhesive layer including a second openingdefined therethrough that overlaps with the module hole; wherein theelectronic module is disposed in an opening formed by at least one ofthe module hole, the first opening and the second opening.
 4. Theelectronic device of claim 2, wherein the light blocking layer furthercomprises a second light blocking layer disposed on the lower surface ofthe functional layer and positioned adjacent to the second opening,wherein the lower surface of the functional layer faces the displaymodule.
 5. The electronic device of claim 1, further comprising a windowblack matrix disposed on an upper surface or lower surface of the windowthat is positioned to overlap the light blocking layer.
 6. Theelectronic device of claim 5, wherein the window black matrix has awidth that is greater than a width of the light blocking layer.
 7. Theelectronic device of claim 5, wherein the window comprises a windowmodule hole that overlaps the module hole, wherein the window blackmatrix is disposed around the window module hole.
 8. The electronicdevice of claim 1, wherein the active area comprises: a first areadefined adjacent to the module hole; and a second area surrounding thefirst area, wherein the at least one pixel is not disposed in the firstarea, and the at least one pixel is disposed in the second area.
 9. Theelectronic device of claim 8, wherein the light blocking layer overlapswith the first area.
 10. The electronic device of claim 1, wherein thelight blocking layer comprises an organic mixture comprising a black dyeor pigment.
 11. The electronic device of claim 1, wherein the electronicmodule comprises at least one of an audio output module, a lightemitting module, a light receiving module, and a camera module.
 12. Anelectronic device comprising: a display module having an active area inwhich pixels are disposed and a non-active area, in which pixels are notdisposed, adjacent to the active area, the active area including amodule hole; a window disposed on the display module; a window blackmatrix disposed on an upper surface or a lower surface of a module areaof the window, the module area overlapping a region of the displaymodule adjacent to the module hole; a light blocking layer disposedbetween the display module and the window black matrix; and anelectronic module disposed in an opening formed by the module hole. 13.The electronic device of claim 12, further comprising: a first adhesivelayer disposed between the display module and the window, the firstadhesive layer including a first opening defined therethrough thatoverlaps with the module hole; a functional layer disposed between thedisplay module and the window, the functional layer including a secondopening defined therethrough that overlaps with the module hole; and asecond adhesive layer disposed between the functional layer and thedisplay module, the second adhesive layer including a third openingdefined therethrough that overlaps with the module hole; wherein theelectronic module is disposed in an opening formed by at least one ofthe module hole, the first opening, the second opening and the thirdopening.
 14. The electronic device of claim 13, wherein the first,second, and third openings have a size greater than the module hole, andthe light blocking layer is disposed in inner areas of the first,second, and third openings between the display module and the windowblack matrix.
 15. The electronic device of claim 14, wherein the lightblocking layer comprises an organic mixture comprising a black dye orpigment.
 16. The electronic device of claim 13, wherein the first,second, and third openings have a size that is substantially the same asthe module hole, and the light blocking layer is disposed between thedisplay module and the second adhesive layer.
 17. The electronic deviceof claim 12, wherein the window black matrix has a width that is greaterthan a width of the light blocking layer.
 18. The electronic device ofclaim 12, wherein the active area comprises: a first area definedadjacent to the module hole; and a second area surrounding the firstarea, wherein the at least one pixel is not disposed in the first area,and the at least one pixel is disposed in the second area.
 19. Theelectronic device of claim 18, wherein the light blocking layer overlapswith the first area.
 20. An electronic device comprising: a displaymodule having an active area in which pixels are disposed and anon-active area, in which pixels are not disposed, adjacent to theactive area, the active area including a module hole; an electronicmodule disposed in an opening formed by the module hole; a windowdisposed on the display module, wherein the active area comprises afirst area defined adjacent to the module hole and a second areasurrounding the first area, the at least one pixel is not disposed inthe first area, and the at last one pixel is disposed in the secondarea, the display module comprising: a lower display substratecomprising a base layer, a circuit device layer, and a display devicelayer; an encapsulation substrate facing the lower display substrate;and a light blocking sealing member is configured to couple the lowerdisplay substrate and the encapsulation substrate in the first area andcomprises a light blocking material.